MAANT A8-A18 Pro 12Pcs Chip CPU BGA Reballing Stencil Template Net for iPhone Chip Repair
sku:6616001722A
Min. Order:1 pieces
$ 14.41 / Piece
Wholesale Price:
| 1 + units | 14.41 |
| 2 + units | 14.18 |
| 8 + units | 13.96 |
| 20 + units | 13.74 |
| 50 + units | 13.51 |
| 100 + units | 13.29 |
Total: $ 14.41
Save $ 0.00
Product Description
Gross Weight
0.056kg
Volume Weight
0.045kg
Length
10.000cm
Width
10.000cm
Height
2.000cm
Weight
0.050kg
EAN
PackageLength
59.000cm
PackageWidth
40.000cm
PackageHeight
35.000cm
PackageQuantity
320
With Retail Packaging
No
MAANT A8-A18 Pro 12Pcs Chip CPU BGA Reballing Stencil Template Net for iPhone Chip Repair
- 【Precision Laser-Cut BGA Stencils】High-precision stainless steel construction with square chamfer design (1/4-1/2 mil) ensures accurate solder ball placement and uniform distribution for professional BGA reballing.
-
【Magnetic Power Tin Planting Platform】The magnetic power tin planting platform provides a secure grip, simplifying the reballing process for a wide range of CPUs. - 【Professional-Grade Manufacturing】Constructed from medical-grade 304/316L stainless steel with ±2μm hole precision, ensuring durability and consistent performance in professional repair environments.
- 【Precision Alignment Features】Each stencil includes four corner positioning holes (Φ3.0mm) and center cross-reference marks for accurate chip-to-stencil alignment during repairs.
- 【Chip-Specific Design】Each model features custom aperture patterns matching specific BGA chip layouts, preventing bridging and cold joints while ensuring optimal solder ball distribution.
Contact Sales Manager
Email: [email protected]
Telephone: +86-19807610528
Skype: Ipartsexpert - Ada Shi